FINITE ELEMENT ANALYSIS
Finite Element Analysis (FEA) simulations performed using ANSYS and Creo Simulate.
GoPro Bracket Insertion Force – Evaluating Tolerance (ANSYS)
The GoPro camera and mounting bracket were used to show how tolerances can affect insertion and sliding forces. Half of the model built and symmetry constraints used. The GoPro bracket was moved 0.005" in each direction relative to the midplane and the force vs. time was plotted. The maximum insertion force varied by about 1N in each case and the sliding force by 0.2N. The analysis demonstrates that even small deviations due to tolerancing can cause a 10-20% difference in insertion forces.
Figure 1. Directional Deformation Contour (mm)
Figure 2. Von-Mises Stress Contour (MPa)
Figure 3. Insertion Force vs. Time for Baseline and Tolerance Edge Cases
PCB Stack Steady-State Thermal Analysis (Creo Simulate)
A steady-state thermal load was applied to a PCB board alone and in a stackup, simulating electronic component heating. Stresses were found to be highest at the mounting features. Lower maximum temperature (184˚F vs. 213˚F) was observed when the components were stacked, likely explained by greater outer surface convection and heat dissipation in added directions.
Figure 1. Temperature Contour (F) for Single Board
Figure 3. Von-Mises Stress Contour (ksi) Rescaled to 1 ksi to Improve Detail
Figure 2. Temperature Contour (F) for 7-Layer Stackup
